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Electronic assembly fabrication chips, circuit boards, packages, and components

Main Author: Charles A. Harper
Format: Printed Media
Bahasa: eng
Terbitan: McGraw Hill , 2002
Subjects:
ELECTRONIC ASSEMBLY
Online Access: http://libcat.uin-malang.ac.id//index.php?p=show_detail&id=21082
ctrlnum slims-21082
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language eng
format Other:Printed Media
Other
author Charles A. Harper
title Electronic assembly fabrication : chips, circuit boards, packages, and components
title_sub chips, circuit boards, packages, and components
publisher McGraw Hill
publishDate 2002
topic ELECTRONIC ASSEMBLY
url http://libcat.uin-malang.ac.id//index.php?p=show_detail&id=21082
contents xii,671 p .; 24 cm.
id IOS2875.slims-21082
institution Universitas Islam Negeri Maulana Malik Ibrahim Malang
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subject_area Karya Umum
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city MALANG
province JAWA TIMUR
repoId IOS2875
first_indexed 2017-12-04T01:46:02Z
last_indexed 2019-05-14T05:13:23Z
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