Applications and interiew = Panduan menulis surat lamaran dan wawancara Inggris - Indonesia

Main Author: Dhanny R. Cyssco (-)
Format:
Terbitan: Jakarta: Bhuana Ilmu Populer , 2004.
Edition: Cet. 6
Subjects:
Online Access: http://opac.depok.go.id:8123/inlislite3/opac/detail-opac?id=9733
http://uploaded_files.depok.go.id:8123/inlislite3/uploaded_files/sampul_koleksi/original/Monograf/9733.jpg
Physical Description: vi, 153 hlm.; 20 cm
Bibliography: Bibliografi: hlm. 152-153
ISBN: 9789799208092