Low temperature inorganic chemical vapor deposition of Ti–Si–N diffusion barrier liners for gigascale copper interconnect applications
| Main Authors: | Eisenbraun, Eric, Kaloyeros, Alain E, Arkles, Barry |
|---|---|
| Format: | Article |
| Bahasa: | eng |
| Terbitan: |
, 2000
|
| Subjects: | |
| Online Access: |
https://zenodo.org/record/3969062 |
| Description not available. |